2014. 10. 13 1/4 semiconductor technical data revision no : 5 voltage detector function of this ic is accurately resetting the system after detecting voltage at the time of switching power on and instantaneous power off in various cpu systems and other logic systems. features h current consumption is low. i ccl =300 a typ. i cch =30 a typ. h resetting output minimum guarantee voltage is low 0.8v typ. h hysteresis voltage is provided. 50mv typ. h reset signal generation starting voltages : kia7019 1.9v typ. kia7033 3.3v typ. kia7021 2.1v typ. kia7034 3.4v typ. kia7023 2.3v typ. kia7035 3.5v typ. kia7025 2.5v typ. kia7036 3.6v typ. kia7027 2.7v typ. kia7039 3.9v typ. kia7029 2.9v typ. kia7042 4.2v typ. kia7031 3.1v typ. kia7045 4.5v typ. kia7032 3.2v typ. h taping type is also available. h qualified to aec-q100. applications (1) as control circuit of battery-backed memory. (2) as measure against erroneous operations at power on-off. (3) as measure against system runaway at instantaneous break of power supply etc. (4) as resetting function for the cpu-mounted equipment, such as personal computers, printers, vtrs and so forth. kia7019ap/af/at~ kia7045ap/af/at bipolar linear integrated circuit type no. marking type no. marking type no. marking kia7019af/at 6a kia7029af/at 6f kia7035af/at 6l kia7021af/at 6b kia7031af/at 6g kia7036af/at 6m kia7023af/at 6c kia7032af/at 6h kia7039af/at 6n kia7025af/at 6d kia7033af/at 6j kia7042af/at 6p kia7027af/at 6e kia7034af/at 6k kia7045af/at 6r marking
2014. 10. 13 2/4 kia7019ap/af/at~kia7045ap/af/at revision no : 5 electrical characteristics (vcc=5v, vee=gnd, ta=25 ? ) maximum ratings (ta=25 ? ) characteristic symbol rating unit supply voltage v cc -0.3 q +15.0 v power dissipation (package limitation) kia7019ap q 45ap p d 400 mw kia7019af q 45af 500 kia7019at q 45at 350 operating temperature t opr -30 q +85 ? storage temperature t stg -55 q +150 ? characteristic symbol test circuit test condition min. typ. max. unit detecting voltage v s 1 r l =200 ? v ol " 0.4v kia7019 kia7021 kia7023 kia7025 kia7027 kia7029 kia7031 kia7032 kia7033 kia7034 kia7035 kia7036 kia7039 kia7042 kia7045 1.75 1.95 2.15 2.35 2.55 2.75 2.95 3.05 3.15 3.25 3.35 3.45 3.75 4.05 4.35 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.2 3.3 3.4 3.5 3.6 3.9 4.2 4.5 2.05 2.25 2.45 2.65 2.85 3.05 3.25 3.35 3.45 3.55 3.65 3.75 4.05 4.35 4.65 v low-level output voltage v ol 1 r l =200 ? - - 0.4 v output leakage current i oh 1 v cc =15v - - 0.1 a hysteresis voltage vs 1 r l =200 ? 30 50 100 mv detecting voltage temperature coefficient vs/ t 1 r l =200 ? - ? 0.01 - %/ ? circuit current at on time iccl 1 v cc =vsmin.-0.05v - 300 500 a circuit current at off time icch 1 v cc =5.25v - 30 50 a threshold operating voltage vopr 1 r l =200 ? , v ol " 0.4v - 0.8 - v "l" transmission delay time tphl 2 r l =1.0k ? , c l =100pf - 10 - s "h" transmission delay time tplh 2 r l =1.0k ? , c l =100pf - 15 - s output current at on time i iol i 1 v cc =vsmin.-0.05v, tc=25 ? 20 - - ma output current at on time ii iol ii 1 v cc =vsmin.-0.05v, tc=-30 q +75 ? 16 - - ma
2014. 10. 13 3/4 kia7019ap/af/at~kia7045ap/af/at revision no : 5
2014. 10. 13 4/4 kia7019ap/af/at~kia7045ap/af/at revision no : 5 precaution for use lead-free soldering condition. elements mounting styles of electronic devices are gaining in further diversification over recent years, and needs for components are all the more expanding in varieties. especially, surface mounting is steadily penetrating into industrial segments as a world-wide popular technical trend. although exposure to high temperature is inevitable during soldering we recommend limiting the soldering temperature to low levels as shown in figure for the sake of retaining inherent excellent reliability. 1. when employing solder reflow method 1) soldering condition ? standard condition : 250 ? (temperature), 10 ? 1sec. (time) ? peak condition : 260 ? 3 ? 2) recommend temperature profile 3) precautions on heating method when resin in kept exposed to high temperature for a long time, device reliability may be marred. therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising. 2. when employing halogen lamps or infrared-ray heaters when halogen lamps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces; such devices cause extensive localized temperature rise. ? please keep a reflow solder operating when surface mount package s soldering. [lead-free soldering temperature profile]
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